JPS6235857B2 - - Google Patents

Info

Publication number
JPS6235857B2
JPS6235857B2 JP57220189A JP22018982A JPS6235857B2 JP S6235857 B2 JPS6235857 B2 JP S6235857B2 JP 57220189 A JP57220189 A JP 57220189A JP 22018982 A JP22018982 A JP 22018982A JP S6235857 B2 JPS6235857 B2 JP S6235857B2
Authority
JP
Japan
Prior art keywords
solder
printed circuit
jet
circuit board
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57220189A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59110458A (ja
Inventor
Kenji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP22018982A priority Critical patent/JPS59110458A/ja
Publication of JPS59110458A publication Critical patent/JPS59110458A/ja
Publication of JPS6235857B2 publication Critical patent/JPS6235857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP22018982A 1982-12-17 1982-12-17 はんだ槽 Granted JPS59110458A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22018982A JPS59110458A (ja) 1982-12-17 1982-12-17 はんだ槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22018982A JPS59110458A (ja) 1982-12-17 1982-12-17 はんだ槽

Publications (2)

Publication Number Publication Date
JPS59110458A JPS59110458A (ja) 1984-06-26
JPS6235857B2 true JPS6235857B2 (en]) 1987-08-04

Family

ID=16747271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22018982A Granted JPS59110458A (ja) 1982-12-17 1982-12-17 はんだ槽

Country Status (1)

Country Link
JP (1) JPS59110458A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115669U (ja) * 1984-01-13 1985-08-05 株式会社日立製作所 はんだ付装置
JPH0216858Y2 (en]) * 1984-11-15 1990-05-10
JP4901304B2 (ja) * 2006-05-30 2012-03-21 株式会社キャロッセ デファレンシャル装置
CN101875143A (zh) * 2010-03-14 2010-11-03 苏州明富自动化设备有限公司 一种波峰焊机叶轮装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828892A (ja) * 1981-08-12 1983-02-19 千住金属工業株式会社 チップ部品搭載プリント基板のはんだ付け装置
JPS5858795A (ja) * 1981-10-03 1983-04-07 石井　銀弥 プリント基板のはんだ付け方法

Also Published As

Publication number Publication date
JPS59110458A (ja) 1984-06-26

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